Semiconductor, Optical, and MEMS Devices

Some of us worked in state of the art fabs for semiconductor processing. Our technical expertise is vast and includes in-depth knowledge of transistors, optical transmitters and receivers, optical sensors, LEDs, reflectors, MEM devices and their usage, magnetic logic devices, beyond CMOS technologies, RF devices, etc. In addition to devices, we also have extensive expertise in chip packaging technologies.

Analog, Mixed-Signal, and I/O Design

We don't just prosecute "chips"; we understand the circuit topology. Our team includes former Intel analog designers with firsthand experience in PLLs, DLLs, high-speed I/O, voltage regulators, and clock distribution. We understand the difference between a schematic and a layout, and how parasitic effects, thermal management, and process variations impact patentability and claim structure.

Process and Packaging Realities

Innovations often happen at the intersection of the die and the package. We have specific experience protecting:

• Advanced Packaging: 2.5D/3D integration, wire bonding, flip-chip, and through-silicon vias (TSVs).
• Thermal Management: On-die thermal sensors, heat spreaders, and dynamic thermal throttling mechanisms.
• Process Technology: Novel transistor structures (FinFET, GAA), interconnects, and material layers that define modern nodes.

What We Focus On In Drafting

We draft applications to preserve multiple claim angles, knowing that infringement can be detected at different stages:

• Device Structure: Physical layers and doping profiles visible in teardowns.
• Circuit Behavior: Functional claims covering switching, regulation, and signal integrity.
• Testing & Calibration: Methods for wafer sort, binning, and post-package repair that improve yield.

Practical Considerations

Because semiconductor innovations can be incremental and prior art is dense, we focus on clear definitions, specific parameter ranges, and alternative embodiments. We draft with an eye toward what competitors can copy in production and how a claim can be enforced against real products—whether through reverse engineering or datasheet specifications.